Part Details for MCIMX6D4AVT08AC by Freescale Semiconductor
Overview of MCIMX6D4AVT08AC by Freescale Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Security and Surveillance
Audio and Video Systems
Transportation and Logistics
Healthcare
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for MCIMX6D4AVT08AC
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
2156-MCIMX6D4AVT08AC-ND
|
DigiKey | IC MPU I.MX6 852MHZ 624FCBGA Min Qty: 5 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
1005 In Stock |
|
$71.2700 | Buy Now |
|
Rochester Electronics | i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core 850MHz, FCBGA 624 RoHS: Compliant Status: Not Recommended for New Designs Min Qty: 1 | 1005 |
|
$61.1600 / $71.9500 | Buy Now |
Part Details for MCIMX6D4AVT08AC
MCIMX6D4AVT08AC CAD Models
MCIMX6D4AVT08AC Part Data Attributes:
|
MCIMX6D4AVT08AC
Freescale Semiconductor
Buy Now
Datasheet
|
Compare Parts:
MCIMX6D4AVT08AC
Freescale Semiconductor
i.MX 6 series 32-bit MPU, Dual ARM Cortex-A9 core 850MHz, FCBGA 624
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | FCBGA-624 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Additional Feature | 24MHZ NOMINAL EXTERNAL FREQUENCY AVAILABLE | |
JESD-30 Code | S-PBGA-B624 | |
JESD-609 Code | e1 | |
Length | 21 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 624 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA624,25X25,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.16 mm | |
Supply Voltage-Max | 1.5 V | |
Supply Voltage-Min | 1.225 V | |
Supply Voltage-Nom | 1.4 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 21 mm | |
uPs/uCs/Peripheral ICs Type | SoC |