Part Details for MCIMX535DVV1CR2 by Freescale Semiconductor
Overview of MCIMX535DVV1CR2 by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MCIMX535DVV1CR2
| Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | IC MPU I.MX53 1.0GHZ 529FBGA / ARM? Cortex?-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 1.0GHz 529-FBGA (19x19) | 1152 |
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$122.4640 / $141.3050 | Buy Now |
Part Details for MCIMX535DVV1CR2
MCIMX535DVV1CR2 CAD Models
MCIMX535DVV1CR2 Part Data Attributes:
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MCIMX535DVV1CR2
Freescale Semiconductor
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Datasheet
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MCIMX535DVV1CR2
Freescale Semiconductor
Multifunction Peripheral, CMOS, PBGA529
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, TEBGA-529 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B529 | |
| JESD-609 Code | e2 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 529 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.85 mm | |
| Supply Voltage-Max | 1.4 V | |
| Supply Voltage-Min | 1.2 V | |
| Supply Voltage-Nom | 1.25 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 19 mm |