Part Details for MCIMX31LVKN5C by Freescale Semiconductor
Overview of MCIMX31LVKN5C by Freescale Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MCIMX31LVKN5C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | Microprocessor PBGA457 RoHS: Compliant Status: Obsolete Min Qty: 1 | 3648 |
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$21.7200 / $25.5500 | Buy Now |
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Chip1Cloud | IC MPU I.MX31 532MHZ 457MAPBGA | 16000 |
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RFQ |
Part Details for MCIMX31LVKN5C
MCIMX31LVKN5C CAD Models
MCIMX31LVKN5C Part Data Attributes:
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MCIMX31LVKN5C
Freescale Semiconductor
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Datasheet
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MCIMX31LVKN5C
Freescale Semiconductor
532MHz, MICROPROCESSOR, PBGA457, 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, MAPBGA-457
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | 14 X 14 MM, 0.50 MM PITCH, ROHS COMPLIANT, MAPBGA-457 | |
| Pin Count | 457 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B457 | |
| JESD-609 Code | e1 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 457 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA457,26X26,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.3 mm | |
| Supply Voltage-Max | 1.65 V | |
| Supply Voltage-Min | 1.55 V | |
| Supply Voltage-Nom | 1.6 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |