Datasheets
MCHP05W4F5601T5E by: SPC Multicomp

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 5600ohm, 150V, 1% +/-Tol, -100,100ppm/Cel, 0805,

Part Details for MCHP05W4F5601T5E by SPC Multicomp

Results Overview of MCHP05W4F5601T5E by SPC Multicomp

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MCHP05W4F5601T5E Information

MCHP05W4F5601T5E by SPC Multicomp is a Metal Glaze/Thick Film Resistor.
Metal Glaze/Thick Film Resistors are under the broader part category of Resistors.

Resistors are passive components that work by limiting electron flow in a circuit. They are available as fixed or as variable (potentionmeters). Read more about Resistors on our Resistors part category page.

Price & Stock for MCHP05W4F5601T5E

Part # Distributor Description Stock Price Buy
DISTI # 01N7043
Newark Res, Thick Film, 5K6, 1%, 0.25W, 0805, Resistance:5.6Kohm, Resistance Tolerance:± 1%, Power Ratin... g:250Mw, Resistor Case/Package:0805 [2012 Metric], Resistor Technology:Thick Film, Resistor Type:High Power, Product Range:- Rohs Compliant: Yes |Multicomp Pro MCHP05W4F5601T5E more RoHS: Compliant Min Qty: 10 Package Multiple: 1 Date Code: 1 Container: Cut Tape 13377
  • 10 $0.0390
  • 25 $0.0220
  • 50 $0.0150
$0.0150 / $0.0390 Buy Now

Part Details for MCHP05W4F5601T5E

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MCHP05W4F5601T5E Part Data Attributes

MCHP05W4F5601T5E SPC Multicomp
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MCHP05W4F5601T5E SPC Multicomp Fixed Resistor, Metal Glaze/thick Film, 0.25W, 5600ohm, 150V, 1% +/-Tol, -100,100ppm/Cel, 0805,
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer MULTICOMP PRO
Reach Compliance Code unknown
ECCN Code EAR99
Samacsys Manufacturer Multicomp Pro
Construction Chip
JESD-609 Code e3
Number of Terminals 2
Operating Temperature-Max 155 °C
Operating Temperature-Min -55 °C
Package Height 0.55 mm
Package Length 2 mm
Package Style SMT
Package Width 1.25 mm
Packing Method TR
Rated Power Dissipation (P) 0.25 W
Resistance 5600 Ω
Resistor Type FIXED RESISTOR
Size Code 0805
Technology METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C
Terminal Finish TIN OVER NICKEL
Tolerance 1%
Working Voltage 150 V

Alternate Parts for MCHP05W4F5601T5E

This table gives cross-reference parts and alternative options found for MCHP05W4F5601T5E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MCHP05W4F5601T5E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
PWC0805-5K6FI TT Electronics Resistors Check for Price Fixed Resistor, Metal Glaze/thick Film, 0.25W, 5600ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP MCHP05W4F5601T5E vs PWC0805-5K6FI
PWC08055K6FT1 TT Electronics Welwyn Components Check for Price RESISTOR, METAL GLAZE/THICK FILM, 0.125W, 1%, 100ppm, 5600ohm, SURFACE MOUNT, 0805, CHIP MCHP05W4F5601T5E vs PWC08055K6FT1
HP05W3F5601T5E Royal Electronic Factory (Thailand) Co Ltd $0.0219 Fixed Resistor, Metal Glaze/thick Film, 0.3333W, 5600ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP MCHP05W4F5601T5E vs HP05W3F5601T5E
PWC0805AS-5K6FI TT Electronics Resistors Check for Price Fixed Resistor, Metal Glaze/thick Film, 0.25W, 5600ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP MCHP05W4F5601T5E vs PWC0805AS-5K6FI

MCHP05W4F5601T5E Frequently Asked Questions (FAQ)

  • The recommended PCB footprint for MCHP05W4F5601T5E is a rectangle with dimensions 5.5mm x 3.5mm, with a 1.5mm x 1.5mm thermal pad in the center. The pad should be connected to a solid ground plane to ensure good thermal dissipation.

  • While MCHP05W4F5601T5E is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the device does not exceed its maximum power dissipation at the expected operating temperature. Additionally, the device's reliability may be affected by prolonged exposure to high temperatures.

  • To ensure the reliability of MCHP05W4F5601T5E in a humid environment, it's recommended to apply a conformal coating to the PCB and follow proper storage and handling procedures to prevent moisture absorption. Additionally, the device should be soldered using a reflow process with a peak temperature below 260°C to prevent damage to the internal components.

  • The recommended soldering process for MCHP05W4F5601T5E is a reflow process with a peak temperature below 260°C, a dwell time above 260°C of 30 seconds, and a total process time of 60-90 seconds. It's essential to follow the soldering profile recommended by the manufacturer to prevent damage to the internal components.

  • While MCHP05W4F5601T5E is designed to be robust, it's essential to consider the vibration environment and ensure that the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Additionally, the PCB should be designed to minimize flexure and ensure that the device is not subjected to excessive mechanical stress.