Part Details for MC9S12XHZ256CAG by Freescale Semiconductor
Overview of MC9S12XHZ256CAG by Freescale Semiconductor
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Part Details for MC9S12XHZ256CAG
MC9S12XHZ256CAG CAD Models
MC9S12XHZ256CAG Part Data Attributes
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MC9S12XHZ256CAG
Freescale Semiconductor
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Datasheet
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MC9S12XHZ256CAG
Freescale Semiconductor
16-bit MCU, S12X core, 256KB Flash, 80MHz, -40/+85degC, QFP 144
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | QFP | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Bit Size | 16 | |
| CPU Family | CPU12 | |
| JESD-30 Code | S-PQFP-G144 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 144 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 16384 | |
| ROM (words) | 262144 | |
| ROM Programmability | FLASH | |
| Speed | 40 MHz | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 |