Part Details for MC9S08PT16VLC by Freescale Semiconductor
Overview of MC9S08PT16VLC by Freescale Semiconductor
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MC9S08PT16VLC
MC9S08PT16VLC CAD Models
MC9S08PT16VLC Part Data Attributes
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MC9S08PT16VLC
Freescale Semiconductor
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Datasheet
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MC9S08PT16VLC
Freescale Semiconductor
S08PT 8-bit MCU, S08 core, 16KB Flash, QFP 32
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | LQFP-32 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Address Bus Width | ||
Bit Size | 8 | |
Boundary Scan | NO | |
CPU Family | HCS08 | |
Clock Frequency-Max | 20 MHz | |
External Data Bus Width | ||
Format | FIXED POINT | |
Integrated Cache | NO | |
JESD-30 Code | S-PQFP-G32 | |
JESD-609 Code | e3 | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 32 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP32,.35SQ,32 | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 2048 | |
ROM (words) | 16384 | |
ROM Programmability | FLASH | |
Speed | 20 MHz | |
Supply Current-Max | 14 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 2.7 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.8 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |