Datasheets
MC9S08GB60CFU by:

MICROCONTROLLER

Part Details for MC9S08GB60CFU by NXP Semiconductors

Overview of MC9S08GB60CFU by NXP Semiconductors

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for MC9S08GB60CFU

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MC9S08GB60CFU Part Data Attributes:

MC9S08GB60CFU NXP Semiconductors
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MC9S08GB60CFU NXP Semiconductors MICROCONTROLLER
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description LFQFP, QFP64,.4SQ,20
Reach Compliance Code unknown
HTS Code 8542.31.00.01
Date Of Intro 2016-08-12
Has ADC YES
Address Bus Width
Bit Size 8
Boundary Scan NO
CPU Family HCS08
Clock Frequency-Max 16 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-PQFP-G64
Length 10 mm
Low Power Mode YES
Number of External Interrupts 1
Number of I/O Lines 56
Number of Terminals 64
Number of Timers 2
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP64,.4SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 220
RAM (words) 2048
ROM (words) 61440
ROM Programmability FLASH
Seated Height-Max 1.6 mm
Speed 40 MHz
Supply Current-Max 120 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

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