There are no models available for this part yet.
Overview of MC88915EI55 by Integrated Device Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for MC88915EI55 by Integrated Device Technology Inc
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Bristol Electronics | 399 |
|
RFQ |
CAD Models for MC88915EI55 by Integrated Device Technology Inc
Part Data Attributes for MC88915EI55 by Integrated Device Technology Inc
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Reach Compliance Code
|
unknown
|
HTS Code
|
8542.39.00.01
|
JESD-30 Code
|
S-PQCC-J28
|
JESD-609 Code
|
e3
|
Max I(ol)
|
0.036 A
|
Moisture Sensitivity Level
|
1
|
Number of Terminals
|
28
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
QCCJ
|
Package Equivalence Code
|
LDCC28,.5SQ
|
Package Shape
|
SQUARE
|
Package Style
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
MATTE TIN
|
Terminal Form
|
J BEND
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
QUAD
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
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