Part Details for MC8641VJ1500KE by NXP Semiconductors
Results Overview of MC8641VJ1500KE by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MC8641VJ1500KE Information
MC8641VJ1500KE by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MC8641VJ1500KE
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MC8641VJ1500KE-954-ND
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DigiKey | 32-BIT POWER ARCHITECTURE SOC, 1 Min Qty: 1 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
26 In Stock |
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$802.0900 | Buy Now |
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Rochester Electronics | 32-Bit Power Architecture SoC, 1500MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, 0 to 105C, Rev 3 RoHS: Compliant Status: Obsolete Min Qty: 1 | 26 |
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$655.5500 / $771.2400 | Buy Now |
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Flip Electronics | Stock | 576 |
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RFQ |
Part Details for MC8641VJ1500KE
MC8641VJ1500KE CAD Models
MC8641VJ1500KE Part Data Attributes
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MC8641VJ1500KE
NXP Semiconductors
Buy Now
Datasheet
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MC8641VJ1500KE
NXP Semiconductors
RISC PROCESSOR
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | FCBGA-1023 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.1 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Address Bus Width | 16 | |
Bit Size | 32 | |
Boundary Scan | YES | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B1023 | |
JESD-609 Code | e2 | |
Length | 33 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 1023 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | ||
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 2.77 mm | |
Speed | 1500 MHz | |
Supply Voltage-Max | 1.15 V | |
Supply Voltage-Min | 1.05 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver (Sn/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 33 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |