Datasheets
MC8641VJ1500KE by:
NXP Semiconductors
Freescale Semiconductor
NXP Semiconductors
Not Found

RISC PROCESSOR

Part Details for MC8641VJ1500KE by NXP Semiconductors

Results Overview of MC8641VJ1500KE by NXP Semiconductors

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Applications Industrial Automation Renewable Energy Robotics and Drones

MC8641VJ1500KE Information

MC8641VJ1500KE by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for MC8641VJ1500KE

Part # Distributor Description Stock Price Buy
DISTI # 2156-MC8641VJ1500KE-954-ND
DigiKey 32-BIT POWER ARCHITECTURE SOC, 1 Min Qty: 1 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT 26
In Stock
  • 1 $802.0900
$802.0900 Buy Now
Rochester Electronics 32-Bit Power Architecture SoC, 1500MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, 0 to 105C, Rev 3 RoHS: Compliant Status: Obsolete Min Qty: 1 26
  • 1 $771.2400
  • 25 $755.8200
  • 100 $724.9700
  • 500 $694.1200
  • 1,000 $655.5500
$655.5500 / $771.2400 Buy Now
Flip Electronics Stock 576
RFQ

Part Details for MC8641VJ1500KE

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MC8641VJ1500KE Part Data Attributes

MC8641VJ1500KE NXP Semiconductors
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MC8641VJ1500KE NXP Semiconductors RISC PROCESSOR
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description FCBGA-1023
Reach Compliance Code compliant
ECCN Code 3A991.A.1
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 16
Bit Size 32
Boundary Scan YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B1023
JESD-609 Code e2
Length 33 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 1023
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Seated Height-Max 2.77 mm
Speed 1500 MHz
Supply Voltage-Max 1.15 V
Supply Voltage-Min 1.05 V
Supply Voltage-Nom 1.1 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver (Sn/Ag)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 33 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

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