Part Details for MC68MH360VR25VL by Freescale Semiconductor
Results Overview of MC68MH360VR25VL by Freescale Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MC68MH360VR25VL Information
MC68MH360VR25VL by Freescale Semiconductor is a Serial IO/Communication Controller.
Serial IO/Communication Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MC68MH360VR25VL
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MC68MH360VR25VL-ND
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DigiKey | IC MPU M683XX 25MHZ 357BGA Min Qty: 3 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
3 In Stock |
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$107.9600 | Buy Now |
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Rochester Electronics | Serial I/O Controller, 1.25MBps PBGA357 RoHS: Compliant Status: Obsolete Min Qty: 1 | 3 |
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$88.2400 / $103.8100 | Buy Now |
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ComSIT USA | QUAD INTEGRATED COMMUNICATION CONTROLLER Serial I/O Controller, 1.25MBps, CMOS, PBGA357 RoHS: Compliant ECCN: 3A991.A.2 |
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RFQ |
Part Details for MC68MH360VR25VL
MC68MH360VR25VL CAD Models
MC68MH360VR25VL Part Data Attributes
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MC68MH360VR25VL
Freescale Semiconductor
Buy Now
Datasheet
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 1.27 MM PITCH, PLASTIC, BGA-357 | |
Pin Count | 357 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO OPERATES AT 3.3 V | |
Address Bus Width | 32 | |
Boundary Scan | YES | |
Bus Compatibility | MC68040; MC68030 | |
Clock Frequency-Max | 25 MHz | |
Communication Protocol | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | |
Data Encoding/Decoding Method | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | |
Data Transfer Rate-Max | 1.25 MBps | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B357 | |
JESD-609 Code | e1 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 357 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.86 mm | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |