Part Details for MC68711E20VFNE2 by Freescale Semiconductor
Overview of MC68711E20VFNE2 by Freescale Semiconductor
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MC68711E20VFNE2
MC68711E20VFNE2 CAD Models
MC68711E20VFNE2 Part Data Attributes:
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MC68711E20VFNE2
Freescale Semiconductor
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Datasheet
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MC68711E20VFNE2
Freescale Semiconductor
8BIT, 20K EPROM, 768RAM, EPP
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Package Description | LCC-52 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Additional Feature | SEATED HEIGHT CALCULATED | |
| Address Bus Width | 16 | |
| Bit Size | 8 | |
| Clock Frequency-Max | 8 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | 8 | |
| JESD-30 Code | S-PQCC-J52 | |
| JESD-609 Code | e3 | |
| Length | 19.125 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 38 | |
| Number of Terminals | 52 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Peak Reflow Temperature (Cel) | 250 | |
| RAM (bytes) | 768 | |
| ROM (words) | 20480 | |
| ROM Programmability | OTPROM | |
| Seated Height-Max | 5.08 mm | |
| Speed | 2 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | HCMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19.125 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |