Part Details for MC68360ZQ25VL by NXP Semiconductors
Results Overview of MC68360ZQ25VL by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MC68360ZQ25VL Information
MC68360ZQ25VL by NXP Semiconductors is a Serial IO/Communication Controller.
Serial IO/Communication Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MC68360ZQ25VL
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
25967861
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Verical | MPU ColdFire M683xx Processor RISC 32bit 0.57um 25MHz 357-Pin BGA Tray RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1501 | Americas - 423 |
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$132.5600 | Buy Now |
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DISTI #
MC68360ZQ25VL
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Avnet Silica | MPU M683xx RISC 32Bit 057um 25MHz 357Pin BGA Tray (Alt: MC68360ZQ25VL) RoHS: Not Compliant Min Qty: 44 Package Multiple: 44 | Silica - 0 |
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Buy Now | |
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Flip Electronics | Stock, ship today | 653 |
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RFQ |
Part Details for MC68360ZQ25VL
MC68360ZQ25VL CAD Models
MC68360ZQ25VL Part Data Attributes
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MC68360ZQ25VL
NXP Semiconductors
Buy Now
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Compare Parts:
MC68360ZQ25VL
NXP Semiconductors
10Mbps, SERIAL COMM CONTROLLER, PBGA357
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 1.27 MM PITCH, PLASTIC, BGA-357 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Additional Feature | ALSO OPERATES AT 5 V SUPPLY | |
| Address Bus Width | 32 | |
| Boundary Scan | YES | |
| Bus Compatibility | 68000 | |
| Clock Frequency-Max | 25 MHz | |
| Communication Protocol | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | |
| Data Encoding/Decoding Method | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | |
| Data Transfer Rate-Max | 10 MBps | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 2 | |
| Number of I/O Lines | 46 | |
| Number of Serial I/Os | 4 | |
| Number of Terminals | 357 | |
| On Chip Data RAM Width | 8 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (words) | 2560 | |
| Seated Height-Max | 1.86 mm | |
| Supply Current-Max | 250 mA | |
| Supply Voltage-Max | 3.3 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |