| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
11AC3420
|
Newark | System Basis Chip, Dcdc 0.8A Vcore Fs1B Can, Lqfp48Ep /Reel Rohs Compliant: Yes |Nxp MC33FS6501CAER2 Min Qty: 2000 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$5.2500 | Buy Now | |
|
DISTI #
MC33FS6501CAER2-ND
|
DigiKey | SYSTEM BASIS CHIP DCDC 0.8A VCO Min Qty: 2000 Lead time: 52 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
|
$5.2538 | Buy Now | |
|
DISTI #
MC33FS6501CAER2
|
Avnet Americas | MC33FS6501CAE/HLQFP48/REEL 13 - Tape and Reel (Alt: MC33FS6501CAER2) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 52 Weeks, 0 Days Container: Reel | 0 |
|
$4.8817 / $5.6020 | Buy Now | |
|
DISTI #
841-MC33FS6501CAER2
|
Mouser Electronics | Power Management Specialized - PMIC System Basis Chip, DCDC 0.8A Vcore FS1B CAN, LQFP48EP RoHS: Compliant | 0 |
|
$5.2500 | Order Now | |
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2000 Package Multiple: 2000 Lead time: 52 Weeks Container: Reel | 0Reel |
|
$5.5600 | Buy Now | ||
|
DISTI #
MC33FS6501CAER2
|
Avnet Silica | MC33FS6501CAE/HLQFP48/REEL 13 (Alt: MC33FS6501CAER2) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 18 Weeks, 0 Days | Silica - 0 |
|
Buy Now | ||
|
DISTI #
MC33FS6501CAER2
|
EBV Elektronik | MC33FS6501CAE/HLQFP48/REEL 13 (Alt: MC33FS6501CAER2) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 54 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
|
Reach Compliance Code
|
compliant
|
|
HTS Code
|
8542.39.00.01
|
|
Factory Lead Time
|
52 Weeks
|
|
Samacsys Manufacturer
|
NXP
|
|
JESD-30 Code
|
S-PQFP-G48
|
|
Length
|
7 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
48
|
|
Number of Transceivers
|
1
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
HLFQFP
|
|
Package Equivalence Code
|
QFP48,.35SQ,20
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Screening Level
|
AEC-Q100
|
|
Seated Height-Max
|
1.6 mm
|
|
Supply Voltage-Nom
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
SMARTMOS
|
|
Telecom IC Type
|
CAN FD/LIN TRANSCEIVER
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.5 mm
|
|
Terminal Position
|
QUAD
|
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
|
Width
|
7 mm
|
