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Power Circuits / Power Management Circuits / MC32PF3000A3EPR2
Datasheets
MC32PF3000A3EPR2 by:
NXP Semiconductors
Freescale Semiconductor
NXP Semiconductors
Not Found

POWER SUPPLY SUPPORT CKT

Part Details for MC32PF3000A3EPR2 by NXP Semiconductors

Results Overview of MC32PF3000A3EPR2 by NXP Semiconductors

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Applications Consumer Electronics Internet of Things (IoT)

MC32PF3000A3EPR2 Information

MC32PF3000A3EPR2 by NXP Semiconductors is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.

A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.

Price & Stock for MC32PF3000A3EPR2

Part # Distributor Description Stock Price Buy
DISTI # 51Y5464
Newark Power Management Ic, I.mx7, Pre-Prog, 4 Buck, 6 Ldo, 1 Boost, Qfn 48/ Reel Rohs Compliant: Yes |Nxp ... MC32PF3000A3EPR2 more RoHS: Compliant Min Qty: 4000 Package Multiple: 1 Date Code: 0 Container: Reel 0
  • 1,500 $3.7000
$3.7000 Buy Now
DISTI # MC32PF3000A3EPR2-ND
DigiKey POWER MANAGEMENT IC I.MX7 PRE- Min Qty: 4000 Lead time: 16 Weeks Container: Tape & Reel (TR) Temporarily Out of Stock
  • 4,000 $4.1330
$4.1330 Buy Now
DISTI # MC32PF3000A3EPR2
Avnet Americas Power Management Integrated Circuit 48-Pin QFN EP T/R - Tape and Reel (Alt: MC32PF3000A3EPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 16 Weeks, 0 Days Container: Reel 0
  • 4,000 $3.6687
  • 8,000 $3.6376
  • 16,000 $3.6066
  • 24,000 $3.5755
  • 32,000 $3.5444
$3.5444 / $3.6687 Buy Now
DISTI # 841-MC32PF3000A3EPR2
Mouser Electronics Power Management Specialized - PMIC Power Management IC, i.MX7, pre-prog, 4 buck, 6 LDO, 1 boost, QF... N 48 more RoHS: Compliant 0
  • 4,000 $4.1300
$4.1300 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 4000 Package Multiple: 4000 Lead time: 16 Weeks Container: Reel 0
Reel
  • 4,000 $3.8000
$3.8000 Buy Now
DISTI # MC32PF3000A3EPR2
Avnet Silica Power Management Integrated Circuit 48Pin QFN EP TR (Alt: MC32PF3000A3EPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days Silica - 4000
Buy Now
DISTI # MC32PF3000A3EPR2
EBV Elektronik Power Management Integrated Circuit 48Pin QFN EP TR (Alt: MC32PF3000A3EPR2) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 18 Weeks, 0 Days EBV - 0
Buy Now
Vyrian Other Function Semiconductors 7924
RFQ

Part Details for MC32PF3000A3EPR2

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MC32PF3000A3EPR2 Part Data Attributes

Parametric Data
MC32PF3000A3EPR2 NXP Semiconductors
Buy Now Datasheet
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MC32PF3000A3EPR2 NXP Semiconductors POWER SUPPLY SUPPORT CKT
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description QFN-48
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 16 Weeks
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V
Adjustable Threshold YES
Analog IC - Other Type INTEGRATED POWER MANAGEMENT UNIT
JESD-30 Code S-XQCC-N48
JESD-609 Code e3
Length 7 mm
Moisture Sensitivity Level 3
Number of Channels 12
Number of Functions 1
Number of Terminals 48
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Seated Height-Max 0.9 mm
Supply Voltage-Max (Vsup) 4.5 V
Supply Voltage-Min (Vsup) 2.8 V
Supply Voltage-Nom (Vsup) 3.6 V
Surface Mount YES
Technology MOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 7 mm

MC32PF3000A3EPR2 Related Parts

MC32PF3000A3EPR2 Frequently Asked Questions (FAQ)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation tool can help optimize the design.

  • To ensure reliable communication, follow the recommended signal integrity guidelines, use a clock signal with a stable frequency, and implement error detection and correction mechanisms such as CRC or ECC.

  • The datasheet provides power-up and power-down sequencing guidelines. In general, the core voltage (VDD) should be powered up before the input/output voltage (VDDIO), and the power-down sequence should be reversed.

  • Use the MCU's power-saving modes (e.g., sleep, standby), reduce clock frequencies, and optimize the peripheral usage. Additionally, consider using a power management IC (PMIC) to optimize the power supply.

  • Follow the guidelines for PCB layout, component placement, and shielding to minimize EMI. Ensure that the design meets the relevant EMC standards (e.g., CISPR, FCC).