Part Details for MC200SP56 by TT Electronics Power and Hybrid / Semelab Limited
Overview of MC200SP56 by TT Electronics Power and Hybrid / Semelab Limited
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Transportation and Logistics
Automotive
Part Details for MC200SP56
MC200SP56 CAD Models
MC200SP56 Part Data Attributes:
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MC200SP56
TT Electronics Power and Hybrid / Semelab Limited
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Datasheet
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MC200SP56
TT Electronics Power and Hybrid / Semelab Limited
56A, 200V, 0.045ohm, 6 CHANNEL, N-CHANNEL, Si, POWER, MOSFET
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | SEMELAB LTD | |
Package Description | FLANGE MOUNT, R-XUFM-X17 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
Avalanche Energy Rating (Eas) | 1300 mJ | |
Configuration | BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE | |
DS Breakdown Voltage-Min | 200 V | |
Drain Current-Max (ID) | 56 A | |
Drain-source On Resistance-Max | 0.045 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
JESD-30 Code | R-XUFM-X17 | |
Number of Elements | 6 | |
Number of Terminals | 17 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 150 °C | |
Package Body Material | UNSPECIFIED | |
Package Shape | RECTANGULAR | |
Package Style | FLANGE MOUNT | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Polarity/Channel Type | N-CHANNEL | |
Pulsed Drain Current-Max (IDM) | 224 A | |
Qualification Status | Not Qualified | |
Surface Mount | NO | |
Terminal Form | UNSPECIFIED | |
Terminal Position | UPPER | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON |