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Power Circuits / Power Management Circuits / MC13892CJVL
Datasheets
MC13892CJVL by:
NXP Semiconductors
Freescale Semiconductor
NXP Semiconductors
Not Found

1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA186

Part Details for MC13892CJVL by NXP Semiconductors

Results Overview of MC13892CJVL by NXP Semiconductors

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Consumer Electronics

MC13892CJVL Information

MC13892CJVL by NXP Semiconductors is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.

A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.

Price & Stock for MC13892CJVL

Part # Distributor Description Stock Price Buy
DISTI # MC13892CJVL
Avnet Americas Power Management 186-Pin BGA - Trays (Alt: MC13892CJVL) RoHS: Compliant Min Qty: 189 Package Multiple: 1 Lead time: 20 Weeks, 0 Days Container: Tray 438
  • 189 $5.8584
  • 200 $5.8102
  • 380 $5.7621
  • 950 $5.7141
  • 1,900 $5.6662
$5.6662 / $5.8584 Buy Now
Future Electronics . RoHS: Compliant pbFree: Yes Min Qty: 945 Package Multiple: 189 Lead time: 20 Weeks Container: Tube 0
Tube
  • 189 $5.9300
  • 378 $5.9000
  • 567 $5.8800
  • 756 $5.8600
$5.8600 / $5.9300 Buy Now
Rochester Electronics Power Management IC, i.MX35/51, 10 Bit ADC, 4 adj buck, 12 adj LDO, MAPBGA 139 RoHS: Compliant Status: Active Min Qty: 1 537
  • 1 $6.6700
  • 25 $6.5400
  • 100 $6.2700
  • 500 $6.0000
  • 1,000 $5.6700
$5.6700 / $6.6700 Buy Now
DISTI # MC13892CJVL
Avnet Silica Power Management 186Pin BGA (Alt: MC13892CJVL) RoHS: Compliant Min Qty: 189 Package Multiple: 189 Lead time: 18 Weeks, 0 Days Silica - 0
Buy Now
DISTI # MC13892CJVL
Chip One Stop Semiconductors RoHS: Compliant pbFree: No Min Qty: 1 Lead time: 0 Weeks, 1 Days Container: Tray 945
  • 1 $10.7000
  • 10 $8.4500
  • 50 $7.5700
  • 100 $7.0300
  • 200 $6.7800
  • 500 $6.4100
$6.4100 / $10.7000 Buy Now
DISTI # MC13892CJVL
EBV Elektronik Power Management 186Pin BGA (Alt: MC13892CJVL) RoHS: Compliant Min Qty: 189 Package Multiple: 189 Lead time: 22 Weeks, 0 Days EBV - 0
Buy Now

Part Details for MC13892CJVL

MC13892CJVL CAD Models

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MC13892CJVL Part Data Attributes

Parametric Data
MC13892CJVL NXP Semiconductors
Buy Now Datasheet
Compare Parts:
MC13892CJVL NXP Semiconductors 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA186
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 12 X 12 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-186
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 20 Weeks
Samacsys Manufacturer NXP
Adjustable Threshold YES
Analog IC - Other Type INTEGRATED POWER MANAGEMENT UNIT
JESD-30 Code S-PBGA-B186
JESD-609 Code e2
Length 12 mm
Moisture Sensitivity Level 3
Number of Channels 1
Number of Functions 1
Number of Terminals 186
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA186,14X14,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.8 V
Supply Voltage-Nom (Vsup) 3.6 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver (Sn/Ag)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 12 mm

Alternate Parts for MC13892CJVL

This table gives cross-reference parts and alternative options found for MC13892CJVL. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC13892CJVL, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MC13892CJVLR2 Freescale Semiconductor Check for Price 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA186, 12 X 12 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-186 MC13892CJVL vs MC13892CJVLR2
MC13892CJVL Freescale Semiconductor Check for Price Power Management IC, i.MX35/51, 10 Bit ADC, 4 adj buck, 12 adj LDO, MAPBGA 139, Tray MC13892CJVL vs MC13892CJVL
MC13892AJVL Freescale Semiconductor Check for Price 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA186, 12 X 12 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-186 MC13892CJVL vs MC13892AJVL
MC13892AJVL Rochester Electronics LLC Check for Price 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA186, 12 X 12 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-186 MC13892CJVL vs MC13892AJVL
MC13892AJVL/R2 Freescale Semiconductor Check for Price 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA186, 12 X 12 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-186 MC13892CJVL vs MC13892AJVL/R2
MC13892CJVLR2 NXP Semiconductors $7.9400 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA186 MC13892CJVL vs MC13892CJVLR2

MC13892CJVL Related Parts

MC13892CJVL Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.

  • Use a reliable communication protocol such as I2C or SPI, and ensure proper signal termination and noise filtering. Also, use a common clock source and ensure clock synchronization between devices.

  • The device has a thermal pad on the bottom, so ensure good thermal conductivity between the pad and the PCB. Use thermal vias and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow.

  • Power up the device in the following sequence: VDD, AVDD, and then DVDD. Ensure a clean power-up and power-down sequence to prevent latch-up. Use a reset signal to initialize the device and ensure a clean reset sequence.

  • Use ESD protection devices such as TVS diodes or ESD arrays on the I/O lines. Ensure that the PCB layout and component placement minimize the risk of ESD damage.