Part Details for MC13760 by Motorola Mobility LLC
Overview of MC13760 by Motorola Mobility LLC
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Applications
Consumer Electronics
Internet of Things (IoT)
Financial Technology (Fintech)
Smart Cities
Part Details for MC13760
MC13760 CAD Models
MC13760 Part Data Attributes
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MC13760
Motorola Mobility LLC
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Datasheet
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MC13760
Motorola Mobility LLC
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA104, PLASTIC, BGA-104
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MOTOROLA INC | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA104,11X11,32 | |
| Pin Count | 104 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B104 | |
| Length | 10 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 104 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA104,11X11,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Nom | 2.775 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |