Part Details for MB89R118A-DI15 by FUJITSU Limited
Overview of MB89R118A-DI15 by FUJITSU Limited
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- CAD Models: (Request Part)
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MB89R118A-DI15
MB89R118A-DI15 CAD Models
MB89R118A-DI15 Part Data Attributes:
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MB89R118A-DI15
FUJITSU Limited
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Datasheet
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MB89R118A-DI15
FUJITSU Limited
Consumer Circuit, WAFER
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FUJITSU LTD | |
| Package Description | DIE, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | DATA RETENTION TIME @ 55 DEGREE CENTIGRADE | |
| Data Retention Time-Min | 10 | |
| Endurance | 10000000000 Write/Erase Cycles | |
| JESD-30 Code | X-XUUC-N | |
| Memory Density | 16384 bit | |
| Memory IC Type | FRAM-EMBEDDED | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Words | 2048 words | |
| Number of Words Code | 2000 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -20 °C | |
| Organization | 2KX8 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Equivalence Code | DIE OR CHIP | |
| Package Shape | UNSPECIFIED | |
| Package Style | UNCASED CHIP | |
| Standby Voltage-Min | 2.7 V | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER |