Part Details for MB82DBS08164C-70L by FUJITSU Limited
Overview of MB82DBS08164C-70L by FUJITSU Limited
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Part Details for MB82DBS08164C-70L
MB82DBS08164C-70L CAD Models
MB82DBS08164C-70L Part Data Attributes:
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MB82DBS08164C-70L
FUJITSU Limited
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Datasheet
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MB82DBS08164C-70L
FUJITSU Limited
Pseudo Static RAM, 8MX16, 70ns, CMOS
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FUJITSU LTD | |
| Package Description | DIE, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 70 ns | |
| JESD-30 Code | X-XUUC-N | |
| Memory Density | 134217728 bit | |
| Memory IC Type | PSEUDO STATIC RAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Organization | 8MX16 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Shape | UNSPECIFIED | |
| Package Style | UNCASED CHIP | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |