Part Details for MB8167A-55P by FUJITSU Limited
Overview of MB8167A-55P by FUJITSU Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for MB8167A-55P
MB8167A-55P CAD Models
MB8167A-55P Part Data Attributes
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MB8167A-55P
FUJITSU Limited
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Datasheet
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MB8167A-55P
FUJITSU Limited
16KX1 STANDARD SRAM, 55ns, PDIP20, PLASTIC, DIP-20
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FUJITSU SEMICONDUCTOR AMERICA INC | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 20 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-PDIP-T20 | |
| Length | 24.64 mm | |
| Memory Density | 16384 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 1 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 20 | |
| Number of Words | 16384 words | |
| Number of Words Code | 16000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 16KX1 | |
| Output Characteristics | 3-STATE | |
| Output Enable | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.36 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | NMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for MB8167A-55P
This table gives cross-reference parts and alternative options found for MB8167A-55P. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MB8167A-55P, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM10480-25CZ | 16KX1 STANDARD SRAM, 25ns, CDIP20, CERDIP-20 | FUJITSU Limited | MB8167A-55P vs MBM10480-25CZ |
| AM21L41-20PCB | Standard SRAM, 4KX1, 200ns, NMOS, PDIP18, PLASTIC, DIP-18 | AMD | MB8167A-55P vs AM21L41-20PCB |
| AM92L44DPC | Standard SRAM, 4KX1, 250ns, MOS, PDIP18, PLASTIC, DIP-18 | AMD | MB8167A-55P vs AM92L44DPC |
| IDT6167LA70LB | Standard SRAM, 16KX1, 70ns, CMOS, CQCC20, 0.300 INCH, LCC-20 | Integrated Device Technology Inc | MB8167A-55P vs IDT6167LA70LB |
| CY2148-45DC | Standard SRAM, 1KX4, 45ns, CMOS, PDIP18, DIP-18 | Cypress Semiconductor | MB8167A-55P vs CY2148-45DC |
| AM9244DPCB | Standard SRAM, 4KX1, 250ns, MOS, PDIP18, PLASTIC, DIP-18 | AMD | MB8167A-55P vs AM9244DPCB |
| AM2167-55DEB | Standard SRAM, 16KX1, 50ns, NMOS, CDIP20, HERMETIC SEALED, CERAMIC, DIP-20 | AMD | MB8167A-55P vs AM2167-55DEB |
| IDT6167SA100DB | Standard SRAM, 16KX1, 100ns, CMOS, CDIP20, 0.300 INCH, CERDIP-20 | Integrated Device Technology Inc | MB8167A-55P vs IDT6167SA100DB |
| HM4-65262CDB:RD | Standard SRAM, 16KX1, 85ns, CMOS, CQCC20 | Matra MHS | MB8167A-55P vs HM4-65262CDB:RD |
| P4C167-10PI | Standard SRAM, 16KX1, 10ns, CMOS, PDIP20, PLASTIC, DIP-20 | Pyramid Semiconductor Corporation | MB8167A-55P vs P4C167-10PI |