Part Details for MB814100-10LP by FUJITSU Limited
Overview of MB814100-10LP by FUJITSU Limited
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MB814100-10LP
MB814100-10LP CAD Models
MB814100-10LP Part Data Attributes:
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MB814100-10LP
FUJITSU Limited
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Datasheet
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MB814100-10LP
FUJITSU Limited
Fast Page DRAM, 4MX1, 100ns, CMOS, PDIP18,
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | FUJITSU LTD | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP18,.3 | |
| Pin Count | 18 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Access Time-Max | 100 ns | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PDIP-T18 | |
| JESD-609 Code | e0 | |
| Memory Density | 4194304 bit | |
| Memory IC Type | FAST PAGE DRAM | |
| Memory Width | 1 | |
| Number of Terminals | 18 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Organization | 4MX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP18,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 1024 | |
| Self Refresh | NO | |
| Standby Current-Max | 0.0002 A | |
| Supply Current-Max | 0.065 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |