Datasheets
MAX97200BEWC+T by:

Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier, 12-WLCSP-N/A, 12 Pins, -40 to 85C

Part Details for MAX97200BEWC+T by Analog Devices Inc

Overview of MAX97200BEWC+T by Analog Devices Inc

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Price & Stock for MAX97200BEWC+T

Part # Distributor Description Stock Price Buy
DISTI # 700-MAX97200BEWC+T
Mouser Electronics Audio Amplifiers Low-Power, Low-Offset, Dual Mode, Class RoHS: Compliant 1903
  • 1 $1.7000
  • 10 $1.5300
  • 100 $1.2300
  • 250 $1.1600
  • 500 $1.0100
  • 1,000 $0.8350
  • 2,500 $0.7770
  • 5,000 $0.7480
  • 10,000 $0.7190
$0.7190 / $1.7000 Buy Now
Analog Devices Inc Low-Power, Low-Offset, Dual Mo Min Qty: 2500 Package Multiple: 1 0
  • 1 $1.7000
  • 1,000 $0.5900
  • 2,500 $0.7772
  • 5,000 $0.7484
$0.5900 / $1.7000 Buy Now

Part Details for MAX97200BEWC+T

MAX97200BEWC+T CAD Models

MAX97200BEWC+T Part Data Attributes:

MAX97200BEWC+T Analog Devices Inc
Buy Now Datasheet
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MAX97200BEWC+T Analog Devices Inc Low-Power, Low-Offset, Dual Mode, Class H DirectDrive Headphone Amplifier, 12-WLCSP-N/A, 12 Pins, -40 to 85C
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ANALOG DEVICES INC
Part Package Code 12-WLCSP-N/A
Package Description WLP-12
Pin Count 12
Manufacturer Package Code 12-WLCSP-N/A
Reach Compliance Code compliant
Date Of Intro 2010-02-17
Samacsys Manufacturer Analog Devices
Consumer IC Type CLASS H AUDIO AMPLIFIER
Gain
JESD-30 Code R-PBGA-B12
JESD-609 Code e2
Length 1.68 mm
Moisture Sensitivity Level 1
Number of Channels 2
Number of Functions 1
Number of Terminals 12
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Power-Nom 0.045 W
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 0.69 mm
Supply Voltage-Max (Vsup) 1.98 V
Supply Voltage-Min (Vsup) 1.62 V
Surface Mount YES
Technology BICMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Terminal Form BALL
Terminal Pitch 0.4 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 1.3 mm

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