Part Details for MAX9025EBT+TG45 by Analog Devices Inc
Overview of MAX9025EBT+TG45 by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Price & Stock for MAX9025EBT+TG45
| Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | UCSP, 1.8V, Nanopower, Beyond- Min Qty: 2500 Package Multiple: 1 | 0 |
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Part Details for MAX9025EBT+TG45
MAX9025EBT+TG45 CAD Models
MAX9025EBT+TG45 Part Data Attributes
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MAX9025EBT+TG45
Analog Devices Inc
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Datasheet
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MAX9025EBT+TG45
Analog Devices Inc
UCSP, 1.8V, nanoPower, Beyond-the-Rails Comparators With/Without Reference, 6-WLCSP-N/A, 6 Pins, -40 to 85C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Part Package Code | 6-WLCSP-N/A | |
| Pin Count | 6 | |
| Manufacturer Package Code | 6-WLCSP-N/A | |
| Date Of Intro | 2004-05-06 | |
| Amplifier Type | COMPARATOR | |
| Average Bias Current-Max (IIB) | 0.002 µA | |
| Bias Current-Max (IIB) @25C | 0.001 µA | |
| Input Offset Voltage-Max | 10000 µV | |
| JESD-30 Code | R-PBGA-B6 | |
| JESD-609 Code | e1 | |
| Length | 1.52 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Type | PUSH-PULL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA6,2X3,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Response Time-Nom | 28000 ns | |
| Seated Height-Max | 0.67 mm | |
| Supply Current-Max | 0.0022 mA | |
| Supply Voltage Limit-Max | 6 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 1 mm |