Part Details for MAX78615+LMU/A01 by Silergy Corporation
Overview of MAX78615+LMU/A01 by Silergy Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Healthcare
Telecommunications
Price & Stock for MAX78615+LMU/A01
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MAX78615+LMU/A01
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Avnet Americas | Energy Measurement Processor 24-Pin TQFN Cut Tape - Rail/Tube (Alt: MAX78615+LMU/A01) RoHS: Not Compliant Min Qty: 750 Package Multiple: 750 Lead time: 35 Weeks, 0 Days Container: Tube | 0 |
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RFQ |
Part Details for MAX78615+LMU/A01
MAX78615+LMU/A01 CAD Models
MAX78615+LMU/A01 Part Data Attributes
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MAX78615+LMU/A01
Silergy Corporation
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Datasheet
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MAX78615+LMU/A01
Silergy Corporation
Microprocessor Circuit, CMOS, 4 X 4 MM, ROHS COMPLIANT, TQFN-24
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Rohs Code | Yes | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | SILERGY CORP | |
Package Description | 4 X 4 MM, ROHS COMPLIANT, TQFN-24 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 35 Weeks | |
JESD-30 Code | S-XQCC-N24 | |
JESD-609 Code | e3 | |
Length | 4 mm | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Seated Height-Max | 0.8 mm | |
Supply Voltage-Max | 3.45 V | |
Supply Voltage-Min | 3.15 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 4 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |