-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for MAX77757HEFG360+ by Analog Devices Inc
Results Overview of MAX77757HEFG360+ by Analog Devices Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Healthcare
MAX77757HEFG360+ Information
MAX77757HEFG360+ by Analog Devices Inc is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Price & Stock for MAX77757HEFG360+
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
700-MAX77757HEFG360
|
Mouser Electronics | Battery Management 14V Input, 3A USB Type C Autonomous Char RoHS: Compliant | 164 |
|
$2.1100 / $5.8300 | Buy Now |
|
|
Analog Devices Inc | 14V Input, 3A USB Type C Auton Package Multiple: 1 | 19817 |
|
$1.6900 / $5.6600 | Buy Now |
Part Details for MAX77757HEFG360+
MAX77757HEFG360+ CAD Models
MAX77757HEFG360+ Part Data Attributes
|
|
MAX77757HEFG360+
Analog Devices Inc
Buy Now
Datasheet
|
Compare Parts:
MAX77757HEFG360+
Analog Devices Inc
3.15A USB Type-C Autonomous Charger with JEITA for 1-Cell Li-ion/LiFePO4 Batteries, 24-LFCSP-3X3X0.55, 24 Pins, -40 to 85C
Select a part to compare: |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | 24-LFCSP-3X3X0.55 | |
| Package Description | FC2QFN-24 | |
| Pin Count | 24 | |
| Manufacturer Package Code | 24-LFCSP-3X3X0.55 | |
| Reach Compliance Code | compliant | |
| Date Of Intro | 2021-03-20 | |
| Samacsys Manufacturer | Analog Devices | |
| Adjustable Threshold | YES | |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT | |
| JESD-30 Code | S-XQCC-N24 | |
| JESD-609 Code | e3 | |
| Length | 3 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Channels | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | VQCCN | |
| Package Equivalence Code | LCC24,.12SQ,16 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.6 mm | |
| Supply Voltage-Max (Vsup) | 13.7 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | QUAD | |
| Threshold Voltage-Nom | +2.5V | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 3 mm |
MAX77757HEFG360+ Frequently Asked Questions (FAQ)
-
A good PCB layout is crucial for optimal performance. Analog Devices recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, it's recommended to use a common mode filter and to decouple the input and output pins with capacitors.
-
To ensure proper power-up and configuration, follow the recommended power-up sequence, and make sure the EN pin is high before applying input voltage. Also, configure the device according to the datasheet recommendations, and use the correct resistors and capacitors for the desired output voltage.
-
The MAX77757HEFG360+ has a thermal shutdown feature that protects the device from overheating. However, it's still important to consider thermal management during design. Ensure good airflow, use a heat sink if necessary, and follow the recommended PCB layout to minimize thermal resistance.
-
To troubleshoot issues, start by checking the input and output voltages, and ensure the device is properly powered up and configured. Use an oscilloscope to check for oscillations or noise, and verify that the output voltage is within the specified range. If issues persist, consult the datasheet and application notes for guidance.
-
Yes, the MAX77757HEFG360+ is a high-frequency device and requires proper EMI/EMC design considerations. Use a common mode filter, decouple the input and output pins, and ensure good PCB layout and shielding to minimize EMI/EMC issues.