Part Details for MAX5864ETM+ by Maxim Integrated Products
Overview of MAX5864ETM+ by Maxim Integrated Products
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (2 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MAX5864ETM+
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
73Y5079
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Newark | Afe, 4 Ch, 8/10Bit, 3 Wire/Serial, 3.3V, Afe Ic Type:Integrated Analog Front End, Afe Ic Application:Data Converters, No. Of Channels:4Channels, Ic Interface Type:3 Wire, Serial, Supply Voltage Min:2.7V, Supply Voltage Max:3.3V Rohs Compliant: Yes |Maxim Integrated/analog Devices MAX5864ETM+ Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 19 |
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$11.0700 / $14.9900 | Buy Now |
DISTI #
MAX5864ETM+-ND
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DigiKey | IC AFE 4 CHAN 10BIT 48TQFN Min Qty: 1 Lead time: 21 Weeks Container: Tube |
35 In Stock |
|
$9.1344 / $14.4200 | Buy Now |
Part Details for MAX5864ETM+
MAX5864ETM+ CAD Models
MAX5864ETM+ Part Data Attributes:
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MAX5864ETM+
Maxim Integrated Products
Buy Now
Datasheet
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Compare Parts:
MAX5864ETM+
Maxim Integrated Products
RF and Baseband Circuit, CMOS, 7 X 7 MM, 0.80 MM HEIGHT, TQFN-48
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MAXIM INTEGRATED PRODUCTS INC | |
Part Package Code | QFN | |
Package Description | HVQCCN, | |
Pin Count | 48 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-XQCC-N48 | |
JESD-609 Code | e3 | |
Length | 7 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.8 mm | |
Surface Mount | YES | |
Technology | CMOS | |
Telecom IC Type | RF AND BASEBAND CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 7 mm |
Alternate Parts for MAX5864ETM+
This table gives cross-reference parts and alternative options found for MAX5864ETM+. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MAX5864ETM+, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MAX5864ETM+T | RF and Baseband Circuit, CMOS, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | Maxim Integrated Products | MAX5864ETM+ vs MAX5864ETM+T |
MAX5864ETM-T | RF and Baseband Circuit, CMOS, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | Maxim Integrated Products | MAX5864ETM+ vs MAX5864ETM-T |