Part Details for MAX5715AWC+ by Analog Devices Inc
Overview of MAX5715AWC+ by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MAX5715AWC+
| Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | Ultra-Small, Quad-Channel, 8-/ Package Multiple: 1 | 0 |
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Part Details for MAX5715AWC+
MAX5715AWC+ CAD Models
MAX5715AWC+ Part Data Attributes
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MAX5715AWC+
Analog Devices Inc
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Datasheet
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MAX5715AWC+
Analog Devices Inc
Ultra-Small, Quad-Channel, 8-/10-/12-Bit Buffered Output DACs with Internal Reference and SPI Interface, 12-WLCSP-N/A, 12 Pins, -40 to 125C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Part Package Code | 12-WLCSP-N/A | |
| Pin Count | 12 | |
| Manufacturer Package Code | 12-WLCSP-N/A | |
| Date Of Intro | 2012-07-26 | |
| Converter Type | D/A CONVERTER | |
| Input Bit Code | OFFSET BINARY | |
| JESD-30 Code | R-PBGA-B12 | |
| Linearity Error-Max (EL) | 0.024% | |
| Moisture Sensitivity Level | 1 | |
| Number of Bits | 12 | |
| Number of Functions | 4 | |
| Number of Terminals | 12 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA12,3X4,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 1.5 mA | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 |