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nanoPower 4-Bump Comparator in Ultra-Tiny 0.73mm x 0.73mm WLP/SOT23 Packages, 4-WLCSP-N/A, 4 Pins, -40 to 125C
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MAX40004ANS02+T by Analog Devices Inc is a Comparator.
Comparators are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
700-MAX40004ANS02+T
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Mouser Electronics | Analog Comparators 600nA Comparator in Ultra-Tiny 0.76 x 0. RoHS: Compliant | 0 |
|
$0.6870 / $0.7050 | Order Now |
|
Analog Devices Inc | 600nA Comparator in Ultra-Tiny Min Qty: 2500 Package Multiple: 1 | 0 |
|
$0.5500 / $1.6700 | Buy Now |
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MAX40004ANS02+T
Analog Devices Inc
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Datasheet
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Compare Parts:
MAX40004ANS02+T
Analog Devices Inc
nanoPower 4-Bump Comparator in Ultra-Tiny 0.73mm x 0.73mm WLP/SOT23 Packages, 4-WLCSP-N/A, 4 Pins, -40 to 125C
Select a part to compare: |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Part Package Code | 4-WLCSP-N/A | |
Package Description | WLP-4 | |
Pin Count | 4 | |
Manufacturer Package Code | 4-WLCSP-N/A | |
Reach Compliance Code | compliant | |
Date Of Intro | 2017-04-07 | |
Samacsys Manufacturer | Analog Devices | |
Amplifier Type | COMPARATOR | |
Average Bias Current-Max (IIB) | 0.09 µA | |
Bias Current-Max (IIB) @25C | 0.09 µA | |
Input Offset Voltage-Max | 32000 µV | |
JESD-30 Code | S-PBGA-B4 | |
Length | 0.728 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 4 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Type | PUSH-PULL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA4,2X2,14 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Response Time-Nom | 25000 ns | |
Seated Height-Max | 0.5 mm | |
Supply Current-Max | 0.0013 mA | |
Supply Voltage Limit-Max | 6 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | |
Terminal Form | BALL | |
Terminal Pitch | 0.35 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 0.728 mm |