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+5V, 5Mbps CAN Transceiver with ±65V Fault Protection, Fault Detection and Reporting, ±25V CMR, and ±40kV ESD Protection, 8-SOIC_N-150_MIL, 8 Pins, -40 to 125C
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MAX33012EASA+ by Analog Devices Inc is a Network Interface.
Network Interfaces are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
700-MAX33012EASA+
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Mouser Electronics | CAN Interface IC +5V, 5Mbps CAN Transceiver with 65V Fault Protection, Fault Detection and Reportin... more RoHS: Compliant | 63 |
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$3.5900 / $7.8100 | Buy Now |
|
Analog Devices Inc | +5V CAN Transceiver with +/-65 Package Multiple: 1 | 9605 |
|
$2.8600 / $7.5900 | Buy Now |
|
Vyrian | Telecommunications | 3301 |
|
RFQ |
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MAX33012EASA+
Analog Devices Inc
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Datasheet
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Compare Parts:
MAX33012EASA+
Analog Devices Inc
+5V, 5Mbps CAN Transceiver with ±65V Fault Protection, Fault Detection and Reporting, ±25V CMR, and ±40kV ESD Protection, 8-SOIC_N-150_MIL, 8 Pins, -40 to 125C
Select a part to compare: |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Part Package Code | 8-SOIC_N-150_MIL | |
Package Description | SOP-8 | |
Pin Count | 8 | |
Manufacturer Package Code | 8-SOIC_N-150_MIL | |
Reach Compliance Code | compliant | |
Date Of Intro | 2020-03-18 | |
Samacsys Manufacturer | Analog Devices | |
Data Rate | 5000 Mbps | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e3 | |
Length | 4.9 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Transceivers | 1 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.75 mm | |
Supply Current-Max | 70 mA | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Telecom IC Type | CAN TRANSCEIVER | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3.9 mm |
A good PCB layout for the MAX33012EASA+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and to avoid routing digital signals near the analog inputs.
The MAX33012EASA+ requires a single 3.3V power supply, and it's recommended to use a low-noise, low-dropout regulator. Power sequencing is not critical, but it's recommended to power up the device after the power supply has stabilized. A 10uF decoupling capacitor is recommended between the VCC and GND pins.
The MAX33012EASA+ can achieve a maximum data rate of 100Mbps, but this is limited by the device's internal clock speed and the quality of the signal transmission. The device's internal clock speed is 50MHz, and the data rate is limited by the Nyquist theorem. Additionally, the signal transmission quality can be affected by the PCB layout, cable quality, and electromagnetic interference.
The MAX33012EASA+ can be configured for different data formats using the device's control registers. The device supports 8b/10b and 64b/66b encoding, and the configuration is done through the ENC8B10B and ENC64B66B registers. The device also supports other data formats, such as 16b/18b and 32b/34b, through the use of external encoding logic.
The MAX33012EASA+ has a maximum junction temperature of 150°C, and it's recommended to keep the device temperature below 125°C for optimal performance. Thermal management considerations include using a heat sink, ensuring good airflow, and avoiding high-power dissipation components nearby. The device's thermal pad should be connected to a solid ground plane to help dissipate heat.