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Part Details for MAX3100ETG+ by Analog Devices Inc
Overview of MAX3100ETG+ by Analog Devices Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MAX3100ETG+
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
700-MAX3100ETG
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Mouser Electronics | UART Interface IC SPI/MICROWIRE-Compatible UART RoHS: Compliant | 1706 |
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$8.9700 / $12.9900 | Buy Now |
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Analog Devices Inc | SPI/MICROWIRE-Compatible UART Min Qty: 1 Package Multiple: 1 | 388 |
|
$7.4200 / $13.0000 | Buy Now |
Part Details for MAX3100ETG+
MAX3100ETG+ CAD Models
MAX3100ETG+ Part Data Attributes
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MAX3100ETG+
Analog Devices Inc
Buy Now
Datasheet
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MAX3100ETG+
Analog Devices Inc
SPI/MICROWIRE-Compatible UART in QSOP-16, 24-LFCSP-4X4X0.75, 24 Pins, -40 to 85C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | 24-LFCSP-4X4X0.75 | |
| Package Description | ROHS COMPLIANT, TQFN-24 | |
| Pin Count | 24 | |
| Manufacturer Package Code | 24-LFCSP-4X4X0.75 | |
| Reach Compliance Code | compliant | |
| Date Of Intro | 1997-07-07 | |
| Samacsys Manufacturer | Analog Devices | |
| Address Bus Width | ||
| Boundary Scan | NO | |
| Clock Frequency-Max | 3.6864 MHz | |
| Communication Protocol | ASYNC, BIT | |
| Data Transfer Rate-Max | 0.028125 MBps | |
| External Data Bus Width | ||
| JESD-30 Code | S-XQCC-N24 | |
| JESD-609 Code | e3 | |
| Length | 4 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Serial I/Os | 1 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC24,.16SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.8 mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |