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Part Details for MAX2550ETN+ by Analog Devices Inc
Overview of MAX2550ETN+ by Analog Devices Inc
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Applications
Consumer Electronics
Price & Stock for MAX2550ETN+
| Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | Complete WCDMA Band 1 Single-C Min Qty: 1 Package Multiple: 1 | 0 |
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Part Details for MAX2550ETN+
MAX2550ETN+ CAD Models
MAX2550ETN+ Part Data Attributes
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MAX2550ETN+
Analog Devices Inc
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Datasheet
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MAX2550ETN+
Analog Devices Inc
Band I, V, and VIII WCDMA Femtocell Transceiver with GSM Monitoring, 56-LFCSP-7X7X0.75, 56 Pins, -40 to 85C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Part Package Code | 56-LFCSP-7X7X0.75 | |
| Pin Count | 56 | |
| Manufacturer Package Code | 56-LFCSP-7X7X0.75 | |
| Date Of Intro | 2012-08-09 | |
| Samacsys Manufacturer | Analog Devices | |
| JESD-30 Code | S-XQCC-N56 | |
| JESD-609 Code | e3 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 56 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC56,.30SQ,16 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.8 mm | |
| Supply Current-Max | 390 mA | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7 mm |