Part Details for MAX2358ETI by Rochester Electronics LLC
Overview of MAX2358ETI by Rochester Electronics LLC
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Part Details for MAX2358ETI
MAX2358ETI CAD Models
MAX2358ETI Part Data Attributes
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MAX2358ETI
Rochester Electronics LLC
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MAX2358ETI
Rochester Electronics LLC
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC28, 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28
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Pbfree Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Part Package Code | QFN | |
Package Description | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
JESD-30 Code | S-XQCC-N28 | |
JESD-609 Code | e0 | |
Length | 5 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 240 | |
Qualification Status | COMMERCIAL | |
Seated Height-Max | 0.9 mm | |
Supply Voltage-Nom | 2.75 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Telecom IC Type | RF AND BASEBAND CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 5 mm |