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Telecommunication Circuits / Cellular Telephone Circuits / MAX2309ETI+T
Datasheets
MAX2309ETI+T by:
Maxim Integrated Products
Analog Devices Inc
Maxim Integrated Products
Not Found

Baseband Circuit, TQFN-28

Part Details for MAX2309ETI+T by Maxim Integrated Products

Results Overview of MAX2309ETI+T by Maxim Integrated Products

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Education and Research Consumer Electronics Internet of Things (IoT) Audio and Video Systems Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

MAX2309ETI+T Information

MAX2309ETI+T by Maxim Integrated Products is a Cellular Telephone Circuit.
Cellular Telephone Circuits are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for MAX2309ETI+T

Part # Distributor Description Stock Price Buy
DISTI # 175-MAX2309ETI+TCT-ND
DigiKey IC CDMA IF VGA/IQ DEMOD 28-TQFN Min Qty: 1 Lead time: 17 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) 1717
In Stock
  • 1 $12.1800
  • 10 $8.3710
  • 25 $7.3792
  • 100 $6.2577
  • 250 $5.9625
  • 2,500 $5.9625
$5.9625 / $12.1800 Buy Now
Bristol Electronics   Min Qty: 1 75
  • 1 $7.1680
  • 5 $4.6592
  • 12 $3.5840
  • 36 $3.3453
$3.3453 / $7.1680 Buy Now
Quest Components BASEBAND CIRCUIT 60
  • 1 $9.6000
  • 5 $4.8000
  • 43 $4.4800
$4.4800 / $9.6000 Buy Now

Part Details for MAX2309ETI+T

MAX2309ETI+T CAD Models

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MAX2309ETI+T Part Data Attributes

Parametric Data
MAX2309ETI+T Maxim Integrated Products
Buy Now Datasheet
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MAX2309ETI+T Maxim Integrated Products Baseband Circuit, TQFN-28
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC
Part Package Code QFN
Package Description TQFN-28
Pin Count 28
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
JESD-30 Code S-XQCC-N28
JESD-609 Code e3
Length 5 mm
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 28
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Equivalence Code LCC28,.2SQ,20
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.8 mm
Supply Current-Max 0.0415 mA
Supply Voltage-Nom 2.75 V
Surface Mount YES
Telecom IC Type BASEBAND CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 5 mm

Alternate Parts for MAX2309ETI+T

This table gives cross-reference parts and alternative options found for MAX2309ETI+T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MAX2309ETI+T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MAX2309ETI+T Analog Devices Inc Check for Price CDMA IF VGAs and I/Q Demodulators with VCO and Synthesizer, 28-LFCSP-5X5X0.75, 28 Pins, -40 to 85C MAX2309ETI+T vs MAX2309ETI+T
MAX2309ETI+ Analog Devices Inc Check for Price CDMA IF VGAs and I/Q Demodulators with VCO and Synthesizer, 28-LFCSP-5X5X0.75, 28 Pins, -40 to 85C MAX2309ETI+T vs MAX2309ETI+

MAX2309ETI+T Related Parts

MAX2309ETI+T Frequently Asked Questions (FAQ)

  • The recommended layout and placement for the MAX2309ETI+T involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended. Additionally, the device should be placed near the connector to minimize the length of the transmission lines.

  • To ensure reliable operation of the MAX2309ETI+T in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device away from heat sources. Additionally, the device should be operated within its specified temperature range, and the power dissipation should be kept within the recommended limits.

  • The MAX2309ETI+T has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding oneself before handling the device, and using ESD protection devices such as wrist straps and mats.

  • To troubleshoot issues with the MAX2309ETI+T, it is recommended to follow a systematic approach, starting with checking the power supply and clock signals, then verifying the device configuration and programming, and finally checking for any signs of physical damage or overheating. A logic analyzer or oscilloscope can be used to debug the device's operation.

  • When using the MAX2309ETI+T in a redundant or fault-tolerant system, it is recommended to consider the device's fault detection and reporting capabilities, as well as its ability to operate in a hot-swap configuration. Additionally, the system should be designed to detect and respond to device failures, and to provide redundant paths for critical signals.