-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
12-Bit, 2.3Gsps Multi-Nyquist DAC, 169-CSP_BGA-11X11X1, 169 Pins, -40 to 85C
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MAX19692EXW+D by Analog Devices Inc is a Digital to Analog Converter.
Digital to Analog Converters are under the broader part category of Converters.
A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Analog Devices Inc | 12-Bit, 2.3Gsps Multi-Nyquist Package Multiple: 1 | 379 |
|
Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
MAX19692EXW+D
Analog Devices Inc
Buy Now
Datasheet
|
Compare Parts:
MAX19692EXW+D
Analog Devices Inc
12-Bit, 2.3Gsps Multi-Nyquist DAC, 169-CSP_BGA-11X11X1, 169 Pins, -40 to 85C
Select a part to compare: |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Part Package Code | 169-CSP_BGA-11X11X1 | |
Package Description | CSBGA-169 | |
Pin Count | 169 | |
Manufacturer Package Code | 169-CSP_BGA-11X11X1 | |
Reach Compliance Code | compliant | |
Date Of Intro | 2006-04-25 | |
Samacsys Manufacturer | Analog Devices | |
Converter Type | D/A CONVERTER | |
Input Bit Code | OFFSET BINARY | |
Input Format | PARALLEL, WORD | |
JESD-30 Code | S-PBGA-B169 | |
Length | 11 mm | |
Linearity Error-Max (EL) | 0.031738% | |
Number of Bits | 12 | |
Number of Functions | 1 | |
Number of Terminals | 169 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA169,13X13,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.5 mm | |
Settling Time-Nom (tstl) | 0.0045 µs | |
Supply Current-Max | 117 mA | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 11 mm |