There are no models available for this part yet.
Overview of MAX1110MJP by Maxim Integrated Products
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 4 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 4 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
CAD Models for MAX1110MJP by Maxim Integrated Products
Part Data Attributes for MAX1110MJP by Maxim Integrated Products
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code
|
DIP
|
Package Description
|
CERAMIC, DIP-20
|
Pin Count
|
20
|
Reach Compliance Code
|
not_compliant
|
ECCN Code
|
3A001.A.2.C
|
HTS Code
|
8542.39.00.01
|
Analog Input Voltage-Max
|
5.55 V
|
Analog Input Voltage-Min
|
|
Conversion Time-Max
|
55 µs
|
Converter Type
|
ADC, SUCCESSIVE APPROXIMATION
|
JESD-30 Code
|
R-CDIP-T20
|
JESD-609 Code
|
e0
|
Linearity Error-Max (EL)
|
0.1953%
|
Moisture Sensitivity Level
|
1
|
Number of Analog In Channels
|
8
|
Number of Bits
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
20
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-55 °C
|
Output Bit Code
|
BINARY, 2'S COMPLEMENT BINARY
|
Output Format
|
SERIAL
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP20,.3
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Peak Reflow Temperature (Cel)
|
240
|
Qualification Status
|
Not Qualified
|
Sample Rate
|
0.05 MHz
|
Sample and Hold / Track and Hold
|
TRACK
|
Seated Height-Max
|
5.08 mm
|
Supply Voltage-Nom
|
2.7 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
MILITARY
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
Time@Peak Reflow Temperature-Max (s)
|
20
|
Width
|
7.62 mm
|
Alternate Parts for MAX1110MJP
This table gives cross-reference parts and alternative options found for MAX1110MJP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MAX1110MJP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MAX1110EPP | ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Serial Access, CMOS, PDIP20, PLASTIC, DIP-20 | Maxim Integrated Products | MAX1110MJP vs MAX1110EPP |
MAX1110CPP | ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Serial Access, CMOS, PDIP20, PLASTIC, DIP-20 | Maxim Integrated Products | MAX1110MJP vs MAX1110CPP |
MAX1110EPP-T | ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Serial Access, CMOS, PDIP20, PLASTIC, DIP-20 | Maxim Integrated Products | MAX1110MJP vs MAX1110EPP-T |
MAX1110CPP+ | ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Serial Access, CMOS, PDIP20, PLASTIC, DIP-20 | Maxim Integrated Products | MAX1110MJP vs MAX1110CPP+ |