Datasheets
MAC7111MAG40 by:
NXP Semiconductors
Freescale Semiconductor
NXP Semiconductors
Not Found

32-BIT, FLASH, 40MHz, RISC MICROCONTROLLER, PQFP144

Part Details for MAC7111MAG40 by NXP Semiconductors

Results Overview of MAC7111MAG40 by NXP Semiconductors

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

MAC7111MAG40 Information

MAC7111MAG40 by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for MAC7111MAG40

Part # Distributor Description Stock Price Buy
DISTI # 81K2247
Newark Mcu, 32Bit, Arm7Tdmi, 40Mhz, Lqfp-144, Product Range:Mac7X Family Mac7111 Series Microcontrollers, ... Device Core:Arm7Tdmi, Data Bus Width:32 Bit, Operating Frequency Max:40Mhz, Program Memory Size:32Kb, No. Of Pins:144Pins Rohs Compliant: Yes |Nxp MAC7111MAG40 more RoHS: Compliant Min Qty: 300 Package Multiple: 1 Date Code: 0 Container: Bulk 0
Buy Now
Ameya Holding Limited LQFP 144/A°/32BIT MCU MAC7111 EXT BUS,16CH A/D / 12NC: 935312611557 55
RFQ

Part Details for MAC7111MAG40

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MAC7111MAG40 Part Data Attributes

MAC7111MAG40 NXP Semiconductors
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MAC7111MAG40 NXP Semiconductors 32-BIT, FLASH, 40MHz, RISC MICROCONTROLLER, PQFP144
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description LFQFP,
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Has ADC YES
Additional Feature ALSO REQUIRES 5V SUPPLY
Address Bus Width 22
Bit Size 32
Boundary Scan NO
Clock Frequency-Max 50 MHz
DAC Channels NO
DMA Channels YES
External Data Bus Width 16
JESD-30 Code S-PQFP-G144
JESD-609 Code e3
Length 20 mm
Moisture Sensitivity Level 3
Number of I/O Lines 112
Number of Terminals 144
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
ROM (words) 524288
ROM Programmability FLASH
Seated Height-Max 1.6 mm
Speed 40 MHz
Supply Voltage-Max 2.75 V
Supply Voltage-Min 2.35 V
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

Alternate Parts for MAC7111MAG40

This table gives cross-reference parts and alternative options found for MAC7111MAG40. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MAC7111MAG40, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MAC7111MAG40 Freescale Semiconductor Check for Price 32-bit MCU, ARM7TDMI-S, 32KB Flash, 50MHz, -40/+125degC, Automotive Qualified, QFP 144 MAC7111MAG40 vs MAC7111MAG40
MAC7111MPV40 Rochester Electronics LLC Check for Price 32-BIT, FLASH, 40MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, 0.50 MM PITCH, LQFP-144 MAC7111MAG40 vs MAC7111MPV40

MAC7111MAG40 Related Parts

MAC7111MAG40 Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 100nF) close to the device's power pins.

  • Use a high-quality external crystal oscillator (e.g., 16MHz) and ensure the PCB layout is optimized for minimal noise and EMI. Also, consider using a crystal oscillator with a built-in capacitor to reduce noise and improve stability.

  • Power up the device in the following sequence: VDD, VDDA, and then VDDIO. Ensure that VDD and VDDA are powered up simultaneously, and VDDIO is powered up last. This sequence helps prevent latch-up and ensures proper device operation.

  • Use a JTAG adapter or a debug probe that supports the ARM CoreSight architecture. Ensure the JTAG clock frequency is within the recommended range (e.g., 1-10 MHz). Also, use a JTAG software tool that supports the MAC7111MAG40's specific JTAG implementation.

  • Ensure good airflow around the device, and use a heat sink or thermal pad if necessary. Keep the device's junction temperature (TJ) below the recommended maximum (e.g., 125°C). Use thermal simulation tools to optimize the PCB design and reduce thermal hotspots.