Part Details for M93S66-BN6 by STMicroelectronics
Overview of M93S66-BN6 by STMicroelectronics
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Applications
Industrial Automation
Part Details for M93S66-BN6
M93S66-BN6 CAD Models
M93S66-BN6 Part Data Attributes:
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M93S66-BN6
STMicroelectronics
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M93S66-BN6
STMicroelectronics
256X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.25 INCH, PLASTIC, DIP-8
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | DIP | |
Package Description | 0.25 INCH, PLASTIC, DIP-8 | |
Pin Count | 8 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 2 MHz | |
Data Retention Time-Min | 40 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | R-PDIP-T8 | |
JESD-609 Code | e0 | |
Length | 9.27 mm | |
Memory Density | 4096 bit | |
Memory IC Type | EEPROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 256 words | |
Number of Words Code | 256 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256X16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | SERIAL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.33 mm | |
Serial Bus Type | MICROWIRE | |
Standby Current-Max | 0.000015 A | |
Supply Current-Max | 0.002 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm | |
Write Cycle Time-Max (tWC) | 5 ms | |
Write Protection | HARDWARE/SOFTWARE |