Part Details for M76DW52003BA70ZT by STMicroelectronics
Overview of M76DW52003BA70ZT by STMicroelectronics
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Part Details for M76DW52003BA70ZT
M76DW52003BA70ZT CAD Models
M76DW52003BA70ZT Part Data Attributes
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M76DW52003BA70ZT
STMicroelectronics
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Datasheet
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M76DW52003BA70ZT
STMicroelectronics
SPECIALTY MEMORY CIRCUIT, PBGA73, 8 X 11.60 MM, 0.80 MM PITCH, LFBGA-73
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | BGA | |
Package Description | 8 X 11.60 MM, 0.80 MM PITCH, LFBGA-73 | |
Pin Count | 73 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 70 ns | |
Additional Feature | STATIC RAM IS ORGANIZED AS 256K X 16; FLASH MEMORY IS ALSO ORGANIZED AS 4M X 8 | |
JESD-30 Code | R-PBGA-B73 | |
JESD-609 Code | e0 | |
Length | 11.6 mm | |
Memory Density | 33554432 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Mixed Memory Type | FLASH+SRAM | |
Number of Functions | 1 | |
Number of Terminals | 73 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 2MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA73,10X12,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.02 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |