Part Details for M392B2G73AM0-CH9 by Samsung Semiconductor
Overview of M392B2G73AM0-CH9 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Space Technology
Industrial Automation
Computing and Data Storage
Electronic Manufacturing
Renewable Energy
Communication and Networking
Part Details for M392B2G73AM0-CH9
M392B2G73AM0-CH9 CAD Models
M392B2G73AM0-CH9 Part Data Attributes
|
|
M392B2G73AM0-CH9
Samsung Semiconductor
Buy Now
Datasheet
|
Compare Parts:
M392B2G73AM0-CH9
Samsung Semiconductor
DDR DRAM, 2GX72, 0.255ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | DIMM | |
| Package Description | DIMM, DIMM240,40 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.255 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 667 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-XDMA-N240 | |
| Length | 133.35 mm | |
| Memory Density | 154618822656 bit | |
| Memory IC Type | DDR3 DRAM MODULE | |
| Memory Width | 72 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 240 | |
| Number of Words | 2147483648 words | |
| Number of Words Code | 2000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | ||
| Organization | 2GX72 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIMM | |
| Package Equivalence Code | DIMM240,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 18.9 mm | |
| Self Refresh | YES | |
| Supply Current-Max | 3.23 mA | |
| Supply Voltage-Max (Vsup) | 1.575 V | |
| Supply Voltage-Min (Vsup) | 1.425 V | |
| Supply Voltage-Nom (Vsup) | 1.5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1 mm | |
| Terminal Position | DUAL |
Alternate Parts for M392B2G73AM0-CH9
This table gives cross-reference parts and alternative options found for M392B2G73AM0-CH9. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M392B2G73AM0-CH9, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| HMT42GR7BMR4C-H9 | SK Hynix Inc | Check for Price | DDR DRAM Module, 2GX72, CMOS, ROHS COMPLIANT, DIMM-240 | M392B2G73AM0-CH9 vs HMT42GR7BMR4C-H9 |
| M393B2G73AH0-CH9 | Samsung Semiconductor | Check for Price | DDR DRAM Module, 2GX72, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 | M392B2G73AM0-CH9 vs M393B2G73AH0-CH9 |