Part Details for M2S090-FCSG325 by Microchip Technology Inc
Results Overview of M2S090-FCSG325 by Microchip Technology Inc
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M2S090-FCSG325 Information
M2S090-FCSG325 by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2S090-FCSG325
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ8516
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Newark | Smartfusion2 Soc Fpga, Arm Cortex-M3, 86Kles 325 Tfbga 11X13.5X1.16Mm Tray Rohs Compliant: Yes |Micr... more RoHS: Compliant Min Qty: 176 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$136.7700 / $144.6900 | Buy Now |
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DISTI #
M2S090-FCSG325-ND
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DigiKey | IC SOC CORTEX-M3 166MHZ 325BGA Min Qty: 176 Lead time: 14 Weeks Container: Tray | Temporarily Out of Stock |
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$144.6901 | Buy Now |
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DISTI #
M2S090-FCSG325
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Avnet Americas | SMARTFUSION2 - Trays (Alt: M2S090-FCSG325) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 14 Weeks, 0 Days Container: Tray | 0 |
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$116.8129 / $124.8000 | Buy Now |
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DISTI #
494-M2S090-FCSG325
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Mouser Electronics | SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs RoHS: Compliant | 0 |
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$144.6900 | Order Now |
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DISTI #
M2S090-FCSG325
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Microchip Technology Inc | SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs, TFBGA, Projected EOL: 2049-02-04 ECCN: EAR99 RoHS: Compliant Lead time: 14 Weeks, 0 Days Container: Tray |
0 Alternates Available |
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$69.8300 / $146.8200 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 0 |
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$126.5400 / $371.4000 | Buy Now |
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NAC | M2S090-FCSG325 RoHS: Compliant Min Qty: 176 Package Multiple: 176 Container: Tray | 0 |
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$121.7600 / $142.6300 | Buy Now |
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Master Electronics | RoHS: Compliant | 0 |
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$126.5400 / $371.4000 | Buy Now |
Part Details for M2S090-FCSG325
M2S090-FCSG325 CAD Models
M2S090-FCSG325 Part Data Attributes
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M2S090-FCSG325
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
M2S090-FCSG325
Microchip Technology Inc
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA325
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | FCBGA-325 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 14 Weeks | |
| JESD-30 Code | R-PBGA-B325 | |
| Length | 13.5 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 180 | |
| Number of Logic Cells | 86184 | |
| Number of Outputs | 180 | |
| Number of Terminals | 325 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA325,21X21,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FPGA SOC | |
| Seated Height-Max | 1.16 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 11 mm |
M2S090-FCSG325 Frequently Asked Questions (FAQ)
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Microchip provides a reference design and layout guidelines in the M2S090-FCSG325 User's Guide (DS50002473A). Additionally, it's essential to follow good thermal management practices, such as using thermal vias, heat sinks, and thermal interface materials to keep the junction temperature below 100°C.
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Microchip provides a Secure Boot and Firmware Encryption Guide (DS50002474A) that outlines the steps to implement secure boot and firmware encryption on the M2S090-FCSG325. This includes using the Microchip CryptoAuthentication device and the MPLAB X IDE.
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The M2S090-FCSG325 is a commercial-grade device, and its use in high-reliability applications (e.g., aerospace, defense, medical) may require additional testing, validation, and qualification. Engineers should consult with Microchip's technical support and review the device's errata and application notes to ensure it meets the specific requirements of their application.
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To optimize power consumption, engineers can use the M2S090-FCSG325's power-saving features, such as dynamic voltage and frequency scaling, clock gating, and sleep modes. Additionally, they can optimize their firmware and software to minimize power consumption, use low-power peripherals, and implement power-efficient algorithms.
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Microchip provides a range of debugging and troubleshooting tools, including the MPLAB X IDE, MPLAB ICD 4, and the Microchip Debug Adapter. Engineers should also use print statements, debug logs, and oscilloscopes to identify and isolate issues. Additionally, they can consult Microchip's technical support, application notes, and online forums for guidance.