Part Details for M2S060-1FCSG325 by Microchip Technology Inc
Overview of M2S060-1FCSG325 by Microchip Technology Inc
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
Smart Cities
Aerospace and Defense
Telecommunications
Communication and Networking
Automotive
Price & Stock for M2S060-1FCSG325
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ8432
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Newark | Smartfusion2 Soc Fpga, Arm Cortex-M3, 56.5Kles 325 Tfbga 11X11X1.01Mm Tray Rohs Compliant: Yes |Microchip M2S060-1FCSG325 RoHS: Compliant Min Qty: 176 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$110.2900 / $116.7100 | Buy Now |
DISTI #
M2S060-1FCSG325-ND
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DigiKey | IC SOC CORTEX-M3 166MHZ 325BGA Min Qty: 176 Lead time: 8 Weeks Container: Tray | Temporarily Out of Stock |
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$116.7105 | Buy Now |
DISTI #
M2S060-1FCSG325
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Avnet Americas | FPGA SmartFusion2 56520 Cells 166MHz 65nm Technology 1.2V 325-Pin F-BGA - Trays (Alt: M2S060-1FCSG325) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
|
$110.2900 / $118.4200 | Buy Now |
DISTI #
494-M2S060-1FCSG325
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Mouser Electronics | SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs RoHS: Compliant | 0 |
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$116.7100 | Order Now |
DISTI #
M2S060-1FCSG325
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Microchip Technology Inc | SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs, Projected EOL: 2049-02-04 RoHS: Compliant pbFree: Yes |
0 Alternates Available |
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$56.3000 / $118.4200 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 176 Package Multiple: 176 | 0 |
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$134.1900 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 0 |
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$102.0400 / $299.5000 | Buy Now |
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NAC | M2S060-1FCSG325 RoHS: Compliant Min Qty: 176 Package Multiple: 176 Container: Tray | 0 |
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$98.1800 / $115.0100 | Buy Now |
DISTI #
M2S060-1FCSG325
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Avnet Silica | FPGA SmartFusion2 56520 Cells 166MHz 65nm Technology 1.2V 325-Pin F-BGA (Alt: M2S060-1FCSG325) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 10 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
M2S060-1FCSG325
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EBV Elektronik | FPGA SmartFusion2 56520 Cells 166MHz 65nm Technology 1.2V 325-Pin F-BGA (Alt: M2S060-1FCSG325) RoHS: Compliant Min Qty: 176 Package Multiple: 176 Lead time: 9 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for M2S060-1FCSG325
M2S060-1FCSG325 CAD Models
M2S060-1FCSG325 Part Data Attributes
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M2S060-1FCSG325
Microchip Technology Inc
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Datasheet
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M2S060-1FCSG325
Microchip Technology Inc
Field Programmable Gate Array, 56520-Cell, CMOS, PBGA325
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | FBGA-325 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 8 Weeks | |
JESD-30 Code | S-PBGA-B325 | |
Length | 11 mm | |
Moisture Sensitivity Level | 3 | |
Number of Inputs | 200 | |
Number of Logic Cells | 56520 | |
Number of Outputs | 200 | |
Number of Terminals | 325 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA325,21X21,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FPGA SOC | |
Seated Height-Max | 1.01 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 11 mm |