Part Details for M29320-13 by Mindspeed Technologies Inc
Overview of M29320-13 by Mindspeed Technologies Inc
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Applications
Consumer Electronics
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
Part Details for M29320-13
M29320-13 CAD Models
M29320-13 Part Data Attributes
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M29320-13
Mindspeed Technologies Inc
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M29320-13
Mindspeed Technologies Inc
Support Circuit, 1-Func, CBGA1156, 35 X 35 MM, CERAMIC, FLIP-CHIP, BGA-1156
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MINDSPEED TECHNOLOGIES INC | |
Part Package Code | BGA | |
Package Description | HBGA, | |
Pin Count | 1156 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Applications | SDH; SONET | |
JESD-30 Code | S-CBGA-B1156 | |
JESD-609 Code | e0 | |
Length | 35 mm | |
Moisture Sensitivity Level | 4 | |
Number of Functions | 1 | |
Number of Terminals | 1156 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | HBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.337 mm | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Telecom IC Type | ATM/SONET/SDH SUPPORT CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm |