-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for M27C800-100F1 by STMicroelectronics
Overview of M27C800-100F1 by STMicroelectronics
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Renewable Energy
Robotics and Drones
Price & Stock for M27C800-100F1
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Quest Components | EPROM, 1M x 8, 42 Pin, Ceramic, DIP | 23 |
|
$7.5712 / $11.3568 | Buy Now |
|
|
Quest Components | EPROM, 1M x 8, 42 Pin, Ceramic, DIP | 7 |
|
$15.0000 / $16.8750 | Buy Now |
|
DISTI #
SMC-M27C800-100F1
|
Sensible Micro Corporation | Eprom, 1M X 8, 42 Pin, Ceramic, Dip RoHS: Not Compliant Min Qty: 180 Lead time: 0 Weeks, 1 Days Date Code: 2004+ | 9180 |
|
$5.1920 | RFQ |
|
|
Velocity Electronics | Our Stock | 5 |
|
RFQ |
Part Details for M27C800-100F1
M27C800-100F1 CAD Models
M27C800-100F1 Part Data Attributes:
|
|
M27C800-100F1
STMicroelectronics
Buy Now
Datasheet
|
Compare Parts:
M27C800-100F1
STMicroelectronics
512KX16 UVPROM, 100ns, CDIP42, WINDOWED, FRIT SEALED, CERAMIC, DIP-42
|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | WINDOWED, FRIT SEALED, CERAMIC, DIP-42 | |
| Pin Count | 42 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Samacsys Manufacturer | STMicroelectronics | |
| Access Time-Max | 100 ns | |
| Alternate Memory Width | 8 | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T42 | |
| JESD-609 Code | e0 | |
| Length | 54.635 mm | |
| Memory Density | 8388608 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 42 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP42,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.97 mm | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.07 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for M27C800-100F1
This table gives cross-reference parts and alternative options found for M27C800-100F1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C800-100F1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K3N4C1000E-DC120 | MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | M27C800-100F1 vs K3N4C1000E-DC120 |
| AM27C800-255DIB | UVPROM, 1MX8, 250ns, CMOS, CDIP42, WINDOWED, CERAMIC, DIP-42 | AMD | M27C800-100F1 vs AM27C800-255DIB |
| KM23C8105B-10 | MASK ROM, 1MX8, 100ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | Samsung Semiconductor | M27C800-100F1 vs KM23C8105B-10 |
| K3N4C1000D-DC15 | MASK ROM, 512KX16, 150ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | M27C800-100F1 vs K3N4C1000D-DC15 |
| M27V800-100XF1 | 512KX16 UVPROM, 100ns, CDIP42, FRIT SEALED, WINDOWED, CERAMIC, DIP-42 | STMicroelectronics | M27C800-100F1 vs M27V800-100XF1 |
| LH538W00D | MASK ROM, 1MX8, 100ns, CMOS, PDIP42, DIP-42 | Sharp Corp | M27C800-100F1 vs LH538W00D |
| M27C800-100B6 | 512KX16 OTPROM, 100ns, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | STMicroelectronics | M27C800-100F1 vs M27C800-100B6 |
| HN62W428P | MASK ROM, 1MX8, 300ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | Hitachi Ltd | M27C800-100F1 vs HN62W428P |
| MX23L8100PC-12 | MASK ROM, 512KX16, 120ns, CMOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | Macronix International Co Ltd | M27C800-100F1 vs MX23L8100PC-12 |
| UPD23C8000XCZ-XXX | MASK ROM, 1MX8, 120ns, MOS, PDIP42, 0.600 INCH, PLASTIC, DIP-42 | NEC Electronics Group | M27C800-100F1 vs UPD23C8000XCZ-XXX |