Part Details for M27C1024-55F1 by STMicroelectronics
Results Overview of M27C1024-55F1 by STMicroelectronics
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
M27C1024-55F1 Information
M27C1024-55F1 by STMicroelectronics is an EPROM.
EPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for M27C1024-55F1
Part # | Distributor | Description | Stock | Price | Buy | |
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NexGen Digital | 49 |
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RFQ |
Part Details for M27C1024-55F1
M27C1024-55F1 CAD Models
M27C1024-55F1 Part Data Attributes
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M27C1024-55F1
STMicroelectronics
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Datasheet
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M27C1024-55F1
STMicroelectronics
64KX16 UVPROM, 55ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | DIP | |
Package Description | WINDOWED, FRIT SEALED, CERAMIC, DIP-40 | |
Pin Count | 40 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Samacsys Manufacturer | STMicroelectronics | |
Access Time-Max | 55 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T40 | |
JESD-609 Code | e0 | |
Length | 52.195 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | UVPROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 40 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 64KX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP40,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.97 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.035 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for M27C1024-55F1
This table gives cross-reference parts and alternative options found for M27C1024-55F1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C1024-55F1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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AM27C1024-55DC | AMD | Check for Price | UVPROM, 64KX16, 55ns, CMOS, CDIP40, CERAMIC, DIP-40 | M27C1024-55F1 vs AM27C1024-55DC |