Datasheets
M27C1001-12F6 by: STMicroelectronics

128KX8 UVPROM, 120ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32

Part Details for M27C1001-12F6 by STMicroelectronics

Overview of M27C1001-12F6 by STMicroelectronics

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Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications

Price & Stock for M27C1001-12F6

Part # Distributor Description Stock Price Buy
DISTI # 04M7698
Newark Eprom, 1Mbit, 120Ns, Dip-32, Memory Configuration:128K X 8Bit, No. Of Pins:32Pins, Ic Case/Package:Dip, Supply Voltage Min:4.5V, Supply Voltage Max:5V, Ic Mounting:Through Hole, Operating Temperature Min:-40°C, Product Range:- Rohs Compliant: Yes |Stmicroelectronics M27C1001-12F6 RoHS: Compliant Min Qty: 21 Package Multiple: 1 Date Code: 0 Container: Bulk 0
Buy Now
Component Electronics, Inc IN STOCK SHIP TODAY 4
Buy Now
Win Source Electronics EPROM UV 1M-bit 128K x 8 120ns 32-Pin CFDIPW Tube / IC EPROM UV 1MBIT 120NS 32CDIP 341
  • 6 $9.4800
  • 13 $7.7780
  • 20 $7.5350
  • 28 $7.2920
  • 36 $7.0490
  • 48 $6.3200
$6.3200 / $9.4800 Buy Now

Part Details for M27C1001-12F6

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M27C1001-12F6 Part Data Attributes

M27C1001-12F6 STMicroelectronics
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M27C1001-12F6 STMicroelectronics 128KX8 UVPROM, 120ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code DIP
Package Description LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Samacsys Manufacturer STMicroelectronics
Access Time-Max 120 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T32
JESD-609 Code e3
Length 41.885 mm
Memory Density 1048576 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code WDIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
Seated Height-Max 5.72 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for M27C1001-12F6

This table gives cross-reference parts and alternative options found for M27C1001-12F6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C1001-12F6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8961411MXX UVPROM, 128KX8, 120ns, CMOS, CDIP32 QP Semiconductor M27C1001-12F6 vs 5962-8961411MXX
FM27C010Q120 UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 Fairchild Semiconductor Corporation M27C1001-12F6 vs FM27C010Q120
M27C1000-12XF6 128KX8 UVPROM, 120ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 STMicroelectronics M27C1001-12F6 vs M27C1000-12XF6
5962-8961406QXX IC 128K X 8 UVPROM, 120 ns, CDIP32, 0.600 INCH, CERAMIC, DIP-32, Programmable ROM Texas Instruments M27C1001-12F6 vs 5962-8961406QXX
AM27C010-120DIB UVPROM, 128KX8, 120ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion M27C1001-12F6 vs AM27C010-120DIB
NM27C010QE120 128KX8 UVPROM, 120ns, CDIP32, WINDOWED, CERAMIC, DIP-32 Texas Instruments M27C1001-12F6 vs NM27C010QE120
5962-8961406MXC UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD M27C1001-12F6 vs 5962-8961406MXC
AM27C010-120DC UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD M27C1001-12F6 vs AM27C010-120DC
AM27C010-120DI UVPROM, 128KX8, 120ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion M27C1001-12F6 vs AM27C010-120DI
TMS27C010A-12JE 1 048 576-Bit Programmable Read-Only Memory 32-CDIP -40 to 85 Texas Instruments M27C1001-12F6 vs TMS27C010A-12JE
Part Number Description Manufacturer Compare
M27C1001-20XF1X 128KX8 UVPROM, 120ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 STMicroelectronics M27C1001-12F6 vs M27C1001-20XF1X
AM27C010-120DEB UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD M27C1001-12F6 vs AM27C010-120DEB
AM27C010-120DI UVPROM, 128KX8, 120ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion M27C1001-12F6 vs AM27C010-120DI
QD27C010-120V10 UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 Intel Corporation M27C1001-12F6 vs QD27C010-120V10
AM27C010-120DIB UVPROM, 128KX8, 120ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion M27C1001-12F6 vs AM27C010-120DIB
M27C1001-25XF1X 128KX8 UVPROM, 120ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 STMicroelectronics M27C1001-12F6 vs M27C1001-25XF1X
M27C1001-25F6X 128KX8 UVPROM, 120ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 STMicroelectronics M27C1001-12F6 vs M27C1001-25F6X
TMS27C010A-12JE 1 048 576-Bit Programmable Read-Only Memory 32-CDIP -40 to 85 Texas Instruments M27C1001-12F6 vs TMS27C010A-12JE
M27C1001-20F1X 128KX8 UVPROM, 120ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 STMicroelectronics M27C1001-12F6 vs M27C1001-20F1X
M5M27C100K-12 UVPROM, 128KX8, 120ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-32 Mitsubishi Electric M27C1001-12F6 vs M5M27C100K-12

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