Part Details for M27512-30F1 by STMicroelectronics
Overview of M27512-30F1 by STMicroelectronics
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Consumer Electronics
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for M27512-30F1
M27512-30F1 CAD Models
M27512-30F1 Part Data Attributes
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M27512-30F1
STMicroelectronics
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Datasheet
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M27512-30F1
STMicroelectronics
64KX8 UVPROM, 300ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 524288 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 64KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.71 mm | |
| Supply Current-Max | 0.125 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | NMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for M27512-30F1
This table gives cross-reference parts and alternative options found for M27512-30F1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27512-30F1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27512-3DCB | UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | M27512-30F1 vs AM27512-3DCB |
| MBM27C512-30WZ | UVPROM, 64KX8, 300ns, CMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | M27512-30F1 vs MBM27C512-30WZ |
| AM27512-30DIB | UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | M27512-30F1 vs AM27512-30DIB |
| TMS27C512-30JE4 | 64KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | M27512-30F1 vs TMS27C512-30JE4 |
| 27LV512-30I/J | 64K X 8 UVPROM, 300 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | M27512-30F1 vs 27LV512-30I/J |
| AM27C512-300DIB | UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27512-30F1 vs AM27C512-300DIB |
| AM27C512-300DEB | UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27512-30F1 vs AM27C512-300DEB |
| MBM27C512-30WZ | 64KX8 UVPROM, 300ns, CDIP28, CERDIP-28 | FUJITSU Limited | M27512-30F1 vs MBM27C512-30WZ |
| AM27512-30DCB | UVPROM, 64KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | M27512-30F1 vs AM27512-30DCB |
| AM27C512-300DE | UVPROM, 64KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27512-30F1 vs AM27C512-300DE |