Datasheets
M2716-1F1 by:

UVPROM, 2KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24

Part Details for M2716-1F1 by Thales Group

Overview of M2716-1F1 by Thales Group

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Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Healthcare Telecommunications

Part Details for M2716-1F1

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M2716-1F1 Part Data Attributes

M2716-1F1 Thales Group
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M2716-1F1 Thales Group UVPROM, 2KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24
Part Life Cycle Code Transferred
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS
Part Package Code DIP
Package Description CERAMIC, DIP-24
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 350 ns
JESD-30 Code R-GDIP-T24
Memory Density 16384 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 2048 words
Number of Words Code 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for M2716-1F1

This table gives cross-reference parts and alternative options found for M2716-1F1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2716-1F1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
ET2716-Q1 UVPROM, 2KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24 Teledyne e2v M2716-1F1 vs ET2716-Q1
NTE2716 UVPROM, 2KX8, 350ns, NMOS, DIP-24 NTE Electronics Inc M2716-1F1 vs NTE2716
ET2716-Q1 UVPROM, 2KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24 Thales Group M2716-1F1 vs ET2716-Q1
QD2716-1 UVPROM, 2KX8, 350ns, MOS, CDIP24, CERDIP-24 Intel Corporation M2716-1F1 vs QD2716-1
Part Number Description Manufacturer Compare
5962-8765004JA UVPROM, 2KX8, 45ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor M2716-1F1 vs 5962-8765004JA
5962-8752901LX UVPROM, 2KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor M2716-1F1 vs 5962-8752901LX
M38510/21004BLX OTP ROM, 2KX8, 55ns, Bipolar, 0.25 X 0.75 INCH, DIP-24 QP Semiconductor M2716-1F1 vs M38510/21004BLX
5962-8873402JA OTP ROM, 2KX8, 45ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor M2716-1F1 vs 5962-8873402JA
5962-8873403JA OTP ROM, 2KX8, 35ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor M2716-1F1 vs 5962-8873403JA
5962-8765004JC UVPROM, 2KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor M2716-1F1 vs 5962-8765004JC
5962-8765003LX UVPROM, 2KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor M2716-1F1 vs 5962-8765003LX
5962-8765004LX UVPROM, 2KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor M2716-1F1 vs 5962-8765004LX
5962-8765002LX UVPROM, 2KX8, 55ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor M2716-1F1 vs 5962-8765002LX
QP7C292A-35WMB UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor M2716-1F1 vs QP7C292A-35WMB

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