Part Details for M24C01-RBN3P by STMicroelectronics
Results Overview of M24C01-RBN3P by STMicroelectronics
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M24C01-RBN3P Information
M24C01-RBN3P by STMicroelectronics is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for M24C01-RBN3P
M24C01-RBN3P CAD Models
M24C01-RBN3P Part Data Attributes
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M24C01-RBN3P
STMicroelectronics
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Datasheet
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M24C01-RBN3P
STMicroelectronics
IC,SERIAL EEPROM,128X8,CMOS,DIP,8PIN,PLASTIC
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Data Retention Time-Min | 40 | |
| Endurance | 1000000 Write/Erase Cycles | |
| I2C Control Byte | 1010DDDR | |
| JESD-30 Code | R-PDIP-T8 | |
| Memory Density | 1024 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Terminals | 8 | |
| Number of Words | 128 words | |
| Number of Words Code | 128 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128X8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | SERIAL | |
| Qualification Status | Not Qualified | |
| Serial Bus Type | I2C | |
| Standby Current-Max | 0.000001 A | |
| Supply Current-Max | 0.0008 mA | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Write Protection | HARDWARE |