-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
128 Kbit Serial I<sup>2</sup>C Bus EEPROM
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
M24128-BFDW6TP by STMicroelectronics is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
M24128-BFDW6TP
|
Avnet Silica | (Alt: M24128-BFDW6TP) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 5 Weeks, 0 Days | Silica - 4000 |
|
Buy Now | |
DISTI #
M24128-BFDW6TP
|
EBV Elektronik | (Alt: M24128-BFDW6TP) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 5 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
M24128-BFDW6TP
STMicroelectronics
Buy Now
Datasheet
|
Compare Parts:
M24128-BFDW6TP
STMicroelectronics
128 Kbit Serial I<sup>2</sup>C Bus EEPROM
Select a part to compare: |
Part Life Cycle Code | Active | |
Ihs Manufacturer | STMICROELECTRONICS | |
Package Description | TSSOP, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | STMicroelectronics | |
Clock Frequency-Max (fCLK) | 1 MHz | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e4 | |
Length | 4.4 mm | |
Memory Density | 131072 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 16384 words | |
Number of Words Code | 16000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 16KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.2 mm | |
Serial Bus Type | I2C | |
Supply Current-Max | 0.0025 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 3.9 mm | |
Write Cycle Time-Max (tWC) | 5 ms |