Part Details for M21328G-12 by Mindspeed Technologies Inc
Overview of M21328G-12 by Mindspeed Technologies Inc
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for M21328G-12
M21328G-12 CAD Models
M21328G-12 Part Data Attributes
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M21328G-12
Mindspeed Technologies Inc
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M21328G-12
Mindspeed Technologies Inc
Consumer Circuit, 4 X 4 MM, ROHS COMPLIANT, MLF-16
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MINDSPEED TECHNOLOGIES INC | |
| Part Package Code | DFN | |
| Package Description | HVQCCN, | |
| Pin Count | 16 | |
| Manufacturer Package Code | MLF | |
| Reach Compliance Code | unknown | |
| ECCN Code | 5A991 | |
| HTS Code | 8542.39.00.01 | |
| Consumer IC Type | CONSUMER CIRCUIT | |
| JESD-30 Code | S-XQCC-N16 | |
| Length | 4 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -10 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 4 mm |